Transient Electromagnetic Simulator for EMP Survivability Analysis of Packaged Electronic Systems

ABSTRACT: This project advances the fundamental design practices (e.g., electromagnetic compatibility countermeasures in designing electronic systems in enclosed or partially enclosed spaces) with a strong potential for breaking the barriers in terms of computer aided design (CAD) simulation accuracies and capabilities. It furthers the art of exploiting available engineering knowledge for simplifying electromagnetic compatibility (EMC) simulation. Ultimately, the proposed research aims to develop, implement and test a unified platform which includes new hybrid methodologies and schemes based on surrogate models (e.g., artificial neural networks, ANNs) and statistical models combined with stand-alone solvers in an integrated fashion to solve problems of higher complexity and to enhanced high power electromagnetic pulses/electromagnetic compatibility (HPEMP/EMC) analysis. The development of surrogate and statistical models is necessary to mimic the behavior of complex HPEMP scenario. Such models bridge the gap between the experimental and the analytical expectations. BENEFIT: IST will commercialize the proposed modeling methodologies through the sale and support of the envisioned approaches as an HPEMP/EMI/EMC software package interface compatible with the existing CAD tools. The developed methodologies will support IST"s ongoing internal and previously DoD-funded research on plasma-based HPM/EMP structures. Furthermore, it supports UT"s research objectives on developing efficient large EM structure analysis and complex board-level simulation methodologies. IST, Inc. has a history of successfully developing and commercializing innovative technologies. Over its 13 year history, the team at IST has designed, developed, and deployed several commercial electronic products including automotive test systems, image processing boards, and a family of large area touch screens.