SBIR/STTR Research Award

Design and Development of a Low Cost, Manufacturable High Voltage Power Module for Energy Storage Systems

Award identifier e40c4d95e2bf22b229ea1e6c729b36ca506c0feea8e731cd7dcbaae119495d60Awarding agency Department of Energy

Award amount

$998,578

Program and phase

SBIR · Phase II

Award year

2013

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Award details

Awarding agency
Department of Energy
Branch
Not reported
Recipient company
Arkansas Power Electronics International, Inc.
Proposal award date
2013-08-14
Contract end date
Not reported
UEI
QZMVB44SHW19
Solicitation number
DE-FOA-0000880
Topic code
08b

Research abstract

Arkansas Power Electronics International, Inc. will design and develop a high performance, high voltage ( & gt; 15 kV) SiC MCPM that is low cost, manufacturable, reliable and reworkable. The target utility scale energy storage applications include power conversion systems for grid-tie, solar array, wind turbine, and vehicle-to-grid to aid in load leveling, frequency control, voltage fluctuations in order to improve the overall power quality and reliability. Presently, most power conversion systems are based on Si IGBTs. However, due to the unique capabilities of SiC and advancement of power converter packaging, this work has the potential to aid in the emergence of smarter, seamless powered grids with less of a dependence on inefficient peak power plants. Phase I work included i.) designing and building a HV discrete demonstrator capable of housing 15 kV SiC devices, ii.) demonstrating a 3 reduction in parasitic inductance in the power loop, iii.) designing 15 kV SiC half-bridge MCPM exhibiting a low junction to case thermal resistance of 0.045 C/W with an extremely low profile of 14 mm (0.57 in) in a standard footprint, iv.) performing a system analysis that highlights a 70 reduction in mass and a 34 reduction in volume, and v.) developing target specifications based on customer needs and existing HV power die. In Phase II, a HV SiC MCPM will be developed such that the assembly process can be easily transferred to manufacturing facilities. The thermal characteristics of the MCPM will be measured to verify the low junction-to-case thermal resistance of the package. Additionally, static and dynamic electrical testing of the MCPM will be performed over temperature to characterize and validate the high temperature packaging design and materials as well as low parasitic impedance packaging scheme. Reliability testing of key MCPM subcomponents such as the power substrate to baseplate attach will be performed to evaluate the materials and developed assembly process. Beyond Phase II, APEI, Inc. will focus on manufacturing process yield optimization, reliability and qualification testing, and marketing of the HV SiC MCPM.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

59 SBIR/STTR records share this UEI (2003–2015). Reported award amounts total $19,645,087. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, National Science Foundation, Department of Transportation

Agency intelligence

Department of Energy

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