Developing Quantitative Capabilities for a Scanning Microwave Impedance Microscope

Currently no instrument exists to quantitatively measure electrical properties (dielectric constant and conductivity) on sub-micron regions, a capability of extreme importance to measure the functioning of sub-micron structures and devices. In particular, such electrical measurements could support the development and manufacture of advanced energy related materials used in technologies such as photovoltaic cells, fuel cells and advanced batteries, thereby increasing performance and/or lowering production costs. The goal of this project is to develop microwave imaging add-on modules and probes capable of quantitatively measuring the electrical properties of small regions of a material using microwaves. These modules for scanning probe microscopes (AFMs) make use of the near-field interaction between the exciting microwaves and a material and can resolve regions 10 nm in size (less than a million atoms) with little perturbation of the material. In this Phase I proposal, the quantitative capabilities of our current microwave probe will be measured, and some proprietary improvements aimed at making a general purpose, easy-to-use instrument available commercially will be tested. A report estimating the potential quantitative accuracy and spatial resolution possible and the refinement needed to achieve them will be provided. PrimeNano currently offers for sale a scanning microwave imaging module, based upon a decade of research at Stanford University, that is compatible with major commercial AFM platforms. Adding quantitative capabilities to this product through this project will provide a key new capability to energy related technologies, and to a wide variety of semiconductor, biological, and materials science applications. Applications include both materials research in academic and industrial labs, as well as manufacturing applications. In a manufacturing environment the quantitative measurement and imaging capabilities could be used both as metrology for process control and as a tool for failure analysis and yield improvement.