Embedded Power and Signal Interconnects for Composites (EPIC)
Award amount
$99,939Program and phase
SBIR · Phase IAward year
2013Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- NEXTGEN AERONAUTICS, INC.
- Proposal award date
- 2013-01-04
- Contract end date
- 2013-07-09
- UEI
- ZKMCL2QBEN46
- Solicitation number
- 2012.2
- Topic code
- MDA12-025
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Optimized Novel Multifunctional Composite Sandwich Structures
- Exoskeleton Augmentation for Flightline and Airfield Operations
- Manufacturable Performance-Tailored Mesostructures for Hypersonics
- Wireless Airborne Instrumentation Network (WAIN)
- Manufacturing High Fidelity Full-scale WTM for Next-generation Air Vehicle Development
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Affordable Reinforced Polymer Composite Structures with Embedded Electrical Interfaces
- Affordable Reinforced Polymer Composite Structures with embedded electrical interfaces
- Affordable Reinforced Polymer Composite Structures with Embedded Graphene Electrical Interfaces
Research funding history
128 SBIR/STTR records share this UEI (2003–2026). Reported award amounts total $45,716,575. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy