Multiband UV/IR Combiner Development

ABSTRACT: Third Generation infrared (IR) images utilize a dual-band design to take advantage of the unique information found in the distinct bands. With the success of this development in the infrared, other areas of sensing are looking to combine information in other wavelength bands. However, test instruments are unavailable that can create such combined images. In this proposal, Reynard Corporation is presenting a way to combine an ultraviolet (UV) band collimated image and an IR band collimated image into a single, highly resolved image. By utilizing a pellicle as the optical combiner, along with custom-designed, precision thin film coatings, the resulting image will have negligible ghosting. A pellicle solution also allows for a very light-weight final instrument. Phase I will demonstrate the ability to use a pellicle to combine the images into a single image. Phase II will further enhance the design, address testing, and demonstrate a fully functional deliverable unit. Our expertise in thin film coatings will allow this same footprint and concept to be used for other wavelength bands, with minimal effort to change only the applied thin film coating. All coating and testing will be done in-house at our San Clemente design and manufacturing facility. BENEFIT: Dual-band IR imaging has greatly enhanced our ability to see not only in complete darkness, but also to see information that is hidden from our normal vision. Having a modeling and simulation environment that can help accelerate the development of new imaging products in other wavelength bands is greatly desired, saving in both time and development cost. The same technology developed in this IR/UV solution can be used for IR/IR, IR/Visible, or Visible/UV scene generation. The goal is to reduce the cost of multiband detector and system development testing. Doing so will bring new products to the market more quickly and at lower cost, enhancing capabilities in areas such as meteorology, micro-machining, eye surgery, and forensics.