SBIR/STTR Research Award

Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments

Award identifier 5f20acec0e819b89b58d0dcbe117bd0353368bf92bf9f3930da6c8b2ebfe5e24Awarding agency Department of Defense · Navy

Award amount

$300,000

Program and phase

SBIR · Phase II

Award year

2011

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Award details

Awarding agency
Department of Defense
Branch
Navy
Recipient company
DFR SOLUTIONS, LLC
Proposal award date
2011-09-14
Contract end date
Not reported
UEI
K4Z5WBTJD6J9
Solicitation number
2008.3
Topic code
OSD08-M01

Research abstract

This Phase II SBIR is focused on expanding on the Phase I results regarding reballing Ball Grid Array (BGA) parts from tin-silver-copper (SAC305) solder to SnPb eutectic solder. Other solder alloys, printed wiring board surface finishes, the die-package impact, solder ball pitch, different size BGAs (ball count), and test methodologies will be examined to fully characterize this process. For the military, this is an excellent interim approach prior to wholesale adoption of Pb-free parts and processes. It is important to understand the reliability risks associated with the reballing procedure, particularly as it relates to thermal cycling, shock and vibration environments.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

12 SBIR/STTR records share this UEI (2009–2019). Reported award amounts total $3,708,073. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense

Agency intelligence

Department of Defense

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