SBIR/STTR Research Award
Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments
Award amount
$99,643Program and phase
SBIR · Phase IAward year
2009Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- DFR SOLUTIONS, LLC
- Proposal award date
- 2009-03-17
- Contract end date
- 2009-09-17
- UEI
- K4Z5WBTJD6J9
- Solicitation number
- 2008.3
- Topic code
- OSD08-M01
Research abstract
Ball grid array (BGA) commercial off the shelf (COTS) parts with SnPb solder balls are becoming obsolete. The uncertainty of Pb-free solder reliability in severe environments has led to a significant upsurge in reballing within the DoD supply chain. How
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Advanced Solutions for Radiation Susceptibility Analysis & Prediction
- Photonic Integrated Circuit Reliability
- Accelerated Radiation Susceptibility Analysis and Prediction (RadSAP) Tool
- Test Optimization and Planning for Reliability (TOP-Rel) Tool
- Mechanistic Model Development for Gold Contaminated Solder Joint Reliability
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Reliability Analysis and Prediction tool for Reballed BGAs in DoD Environments
- Assessment of Reballing Methods for Ball Grid Array (BGA) Devices
Research funding history
12 SBIR/STTR records share this UEI (2009–2019). Reported award amounts total $3,708,073. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense