Copper Graphite Composite Passive Thermal Control for High Density Interconnect PCB's

Thermal management, CTE control, and mechanical stability are critical for lightweight aerospace/defense printed circuit board (PCB) applications. Current materials for PCB"s such as copper and graphite epoxy laminates with copper foil cladding do not adequately address thermal requirements, reliability, and weight reduction in a single material. New materials must offer higher thermal conductivity (especially in Z axis) in addition to being thinner, lighter, and fit within existing printed circuit board process and chemistry. In Phase I, MMCC developed a pressure infiltrated copper graphite composite thermal control layer product 0.010"thick which has been successfully incorporated into fully functional high density interconnect multi-layer PCBA"s at the largest aerospace/defense PCB fabricator in the US using standard PCB processes and chemistry to IPC 6012 class 3 criteria. Phase II and Phase III will focus on cost reduction and transition into AMDR and other appropriate aerospace/defense programs.