Lightweight, CTE Matched Copper Graphite Composite Cores For Enhanced PCB Thermal Management

Thermal Management, CTE control, and mechanical stability are critical for lightweight aerospace/defense printed circuit board (PCB) applications. Current materials for PCBs do not adequately address thermal, reliability, and weight reduction in a single material solution. Historically, the solutions used today have been the same solutions used over the last few decades. The introduction of copper or aluminum into the circuit card, or more exotic materials like copper invar copper, or graphite epoxy laminates with copper foil cladding when thermal & CTE control is required have been the most popular. However, with the new generation of electronics comes the need to develop the next generation of thermal conductive materials. The new materials developed must offer higher thermal conductivity in addition to being thinner, lighter, and fit within existing printed circuit manufacturing processes. MMCC proposes to develop and demonstrate thin copper graphite composite sheets made by pressure infiltration casting will significantly advance current state of the art PCB thermal management.