SBIR/STTR Research Award
Innovative Manufacturing Process Improvements
Award amount
$499,991Program and phase
SBIR · Phase IIAward year
2011Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- SANSTEK, INC.
- Proposal award date
- 2011-08-15
- Contract end date
- Not reported
- UEI
- Not reported
- Solicitation number
- 2009.3
- Topic code
- MDA05-019
Research abstract
The objective of the proposed effort is to provide highly integrated MEMS based IMU using a planar IMU device and a combination of novel analog control and readout mechanizations along with an adaptive digital control compensation system in an FPGA. The resulting micro IMU and associated Integrated Avionics Assembly will have the gyro and accelerometer performance and the size, weight, and power to allow an extremely small kill vehicle. The proposed Integrated Avionics Assembly has a fully capable IMU and Kill Vehicle GN & C with embedded PowerPC processor for full KV flight control and navigation. The IMU consists of fundamentally only two sections or parts. First the planar MEMS IMU sensor packages all 3 axis sensors on one monolithic substrate in order to allow packaging without separately mounted devices for each axis. The control loop and compensation section which consists front end pick off, drive and filtering with an FPGA for digital control, compensation and readout. The resulting micro IMU will be useful in many applications that require an IMU and all vehicle flight control functions to be of approximately the size of a hockey puck.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Innovative Manufacturing Process Improvements
- Laser Ordnance Safe-Arm Distributor (LOSAD)
- Single-Chip MEMS IMU for Integrated Avionics and Seeker Image Stabilization for the MKV
- Precision Low Cost Assembly Technique for Manufacturing of Seeker Optics
- Integrated Avionics Manufacturing Concept: Imbedded Component/Die Technology (IC/DT)