Single-Chip MEMS IMU for Integrated Avionics and Seeker Image Stabilization for the MKV

A single high-bandwidth MEMS Inertial Measurement Unit can provide data for both guidance and seeker image stabilization functions required for the MKV. The IMU integrates three gyroscopes and five accelerometers on the same chip, including a planar z-gyroscope. The data for each function can be obtained and separated by combining the signals from all the instruments included in the proposed MKV IMU design. The chip is vacuum-encapsulated at the wafer level to form a rugged die that can be handled easily and imbedded into high-density packaging such as the high-density PCB to be designed by STI Electronics. The die is about 2 cm square by 2 mm thick. MSSA will enable others to implement their own electronics to operate the IMU. When the IMU die is integrated with an FPGA in the package, the resultant IMU will be the smallest, lowest cost product available. During this program, the high bandwidth capability will be developed and the gyro performance improved by making practical modifications to the present design. IMU chips will be fabricated, imbedded into the STI package and operated with digital electronics that are implemented in an FPGA.