Alignment Tolerant Components for Robust Optic Signal Distribution

This program develops a connector system to provide robust optical interconnects at the chip-level, board-level and box-level. Due to increasing bandwidth demand and the desire to reduce weight associated with the electrical interconnect and EMI shielding, aerospace weapon systems are pushing to bring optical channels right up to the chip-level component. The goal of this program is to embed optical pathways within board and connector structures that provide mechanical protection against damage that may occur during assembly, test and operation in extreme environments.