Robust Optic Signal Distribution within Enclosures for Aerospace Applications

nanoPrecision Products Inc. proposes to develop a complete and fundamentally new connection system for electro-optical avionic systems. nPP’s connection system will be compatible with the VME bus open architecture, and will hence enable fly-by-light (FBL) guidance and control systems. The connection system will use metallic ferrules that are robust, field maintainable, and immune to electro magnetic interference (EMI) in wartime scenarios. Furthermore, the metallic ferrules will be producible with nPP’s economical, high-production volume, ultra-high precision stamping processes. nPP proposes to investigate new fiber-optic interconnects that will provide integrated electro-optical systems compatible with the VME bus architecture. nPP will design and evaluate new metallic ferrules that can accommodate 12x1 fiber ribbons and are producible with nPP''s ultra-high precision stamping technology. These economical terminated ferrules will be arrayed within connectors to achieve hundreds of channels, perhaps as high as 432 channels, in a single Po connector. During this Phase I SBIR, nPP will design and evaluate the connection density and manufacturability of two novel connectors: a round military-style enclosure connector that can transmit electrical and optical signals across the enclosure walls through hybrid signal pins, and a right-angle, backplane-to-daughtercard connector that is dimensionally compatible with the Po interface on VME cards. BENEFIT: nanoPrecision Products Inc. (nPP) proposes to use their low-cost, high-volume, precision stamping processes to develop higher density connectors for optical signal distribution through (1) transceiver to card edge connector, (2) card edge to backplane connector, and (3) card or motherboard to the enclosure connector. This is widely applicable to fiber to-the-home networks now being widely deployed throughout the United States. The application base can also be expanded to include automotive data transmission and optical sensors providing lower cost and ease of installation and repair. Additionally, EMI-proof hermetic micro-electronic and optoelectronic packages and sensors in general will benefit. High density interfaces for optical transceivers, card edge connectors, mother board connectors, and enclosure connectors are also used in commercial datacenters. nPP proposes to develop a modular, scalable, right-angle, metallic connector and a high-density, hybrid, optical/electrical circular connector which can be used with existing commercial and ribbon cabling. The backplane fiber ribbon can be embedded in a fiberglass resin, a polymer, or a composite material, to form a monolithic optical motherboard. This can eliminate the unwieldy mesh of fibers within an enclosure. The demonstrated manufacturing precision achieved by nPP permits implementation of these high density array and circular connectors for both single mode and multimode applications. The proposed right angle connector concept can also be used for monitoring the health of composite structures by embedding the connectors and Bragg grating fibers within the composite structure. With respect to the manufacturing process, there is a need to develop a deterministic manufacturing capability to fabricate metal products with the tolerances now only achievable with semi-conductor processing based technologies. The final goal is to develop the technologies leading to an integrated science of machining, stamping, tool and die formation and the related computer aided design methodology to produce low cost and highly repeatable metallic products and components broadly applicable to many commercial industries