High Compliance Carbon Nanotube based Thermal Interface Material for Space Applications

ABSTRACT: The U.S. Air Force is seeking high-thermal conductivity gaskets to improve the thermal efficiency of space-based electronic systems. Advanced gasket materials will enhance the performance of electronic packages by improving heat dissipation during operation. Moreover, thermal management systems are often large, relatively heavy components that add volume and weight to the spacecraft. To address the need for improved thermal interface materials (TIM), Carbon Nanotube (CNT) Array-based TIM"s will be developed. These materials will be lightweight, highly compliant, reworkable, and highly thermally conductive. In addition, the CNT-based TIM"s will significantly reduce assembly, integration, and test time (AI & T) for the spacecraft. BENEFIT: With increased thermal capacity, as well as lighter weight and smaller packaging, thermal gaskets with carbon nanotube array could revolutionize the thermal management systems used in microprocessors, telecommunication systems, and power supplies. Heat dissipation is often a limiting factor in the performance of these systems, and the use of interface materials with significantly higher thermal conductivities will enable the construction of smaller and lighter systems, while also reducing power consumption. The results will be improved operational performance and longer lifetimes in the electronic components.