SBIR/STTR Research Award

Inverted 3J Tandem Thermophotovoltaic Modules

Award identifier 9172f23497f5d5a63c668815a83abb8f1878cba1db63369da53ef0e74d5dfb96Awarding agency National Aeronautics and Space Administration

Award amount

$99,486

Program and phase

SBIR · Phase I

Award year

2011

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
Spire Corporation
Proposal award date
2011-02-18
Contract end date
2011-09-29
UEI
RG46KJGARZF4
Solicitation number
Not reported
Topic code
S3.03

Research abstract

Spire Semiconductor proposes to make an InGaAs-based three-junction (3J) tandem thermophotovoltaic (TPV) cell to utilize more of the blackbody spectrum (from a GPHS) efficiently. Semi-insulating InP wafers will be used for monolithically integrated module (MIM)compatibility and to achieve low free-carrier absorption. In Phase 1, we will design, epitaxially grow, and process large area single junction test cells for each of the three bandgaps proposed (to evaluate material quality), as well as for a full tandem cell structure. In Phase 2, we would further refine the structure and incorporate the material into MIM modules.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

429 SBIR/STTR records share this UEI (1983–2014). Reported award amounts total $73,907,551. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, National Science Foundation, Department of Energy, Department of Health and Human Services, Department of Commerce

Agency intelligence

National Aeronautics and Space Administration

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