Wide Temperature Cycling Tolerant Electronic Packaging Substrates

Planetary exploration missions require electronics packaging that can withstand extreme temperatures and numerous temperature cycles (-230C to +350C). The present project proposes a novel metallized ceramic substrates that could potentially withstand these temperature extremes and serve as reliable packaging platforms. Phase I research will be aimed at confirming this - new metallized ceramic substrates will be subjected to severe thermal cycling tests and any change in metallization adhesion to ceramic or change in electrical properties will be quantified. If Phase I is successful, we will proceed to addressing the other important issues, like etching, plating, wire bonding and die bonding to new substrates to result in a demonstrator package capable of withstanding the extreme thermal cycling.