SBIR/STTR Research Award

Innovative Annealing Apparatus for Mercury-Based, Compound Semiconductors

Award identifier a15a75d4c8b360be14aa5a3c7d0797b0fcac7bcf4f8f624d3037b08606dd9ba4Awarding agency Department of Defense · Army

Award amount

$69,941

Program and phase

SBIR · Phase I

Award year

2010

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Award details

Awarding agency
Department of Defense
Branch
Army
Recipient company
PHOTRONIX
Proposal award date
2010-06-24
Contract end date
2010-12-24
UEI
Not reported
Solicitation number
2010.1
Topic code
A10-022

Research abstract

Infrared photovoltaic imagers based on HgCdTe are being developed to meet ever more stringent requirements. Anneals are used for reducing the Hg vacancy concentration by annealing at near Hg saturation pressure, for diffusions under a specific Hg vapor pressure, for annealing after ion implants to diffuse the implanted element and for activating implanted dopants. In the most commonly used anneal procedure several wafers are sealed (using a glass-blowing torch) into an evacuated fused quartz ampoule along with a small amount of Hg. The practical problems that occur for wafers over about 5 cm in diameter are first of all that larger quartz ampoules become more difficult to seal under vacuum and the extended sealing time may lead to heating and damaging the wafers. Also, the cost of the quartzware that is destroyed in the process becomes more significant in larger sizes. A new anneal process is required that avoids these problems. The difficulty at first appears to be that Hg vapor must be contained by a seal that is itself at the same temperature as the wafers, in order to prevent Hg vapor from condensing or escaping. This requirement can, however, be avoided by use of our new technology.

Technology keywords

Not reported

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Agency intelligence

Department of Defense

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