SBIR/STTR Research Award

Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics

Award identifier b0a3bf08f99b28c9d02a0d3b7eb2ae30d3127e5d5604f1f4ce1ff9aa1d5f9e6dAwarding agency National Aeronautics and Space Administration

Award amount

$100,000

Program and phase

SBIR · Phase I

Award year

2010

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Award details

Awarding agency
National Aeronautics and Space Administration
Branch
Not reported
Recipient company
SIENNA TECHNOLOGIES, INC.
Proposal award date
2010-01-29
Contract end date
2010-07-29
UEI
W8VZALJ8J617
Solicitation number
Not reported
Topic code
S5.05

Research abstract

The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500ºC in extreme environments of space exploration. The Phase I program will demonstrate a reliable direct bond copper (DBC) process for Si3N4 substrates, develop high current carrying hermetic feedthroughs, an innovative transient liquid phase (TLP) die attach, and a monometallic wire bonding capable of reliable operation above 500ºC; and fabricate and test a hermetic single-chip module.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

61 SBIR/STTR records share this UEI (1993–2017). Reported award amounts total $13,380,891. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, National Science Foundation

Agency intelligence

National Aeronautics and Space Administration

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