Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics
Award amount
$100,000Program and phase
SBIR · Phase IAward year
2010Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- SIENNA TECHNOLOGIES, INC.
- Proposal award date
- 2010-01-29
- Contract end date
- 2010-07-29
- UEI
- W8VZALJ8J617
- Solicitation number
- Not reported
- Topic code
- S5.05
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Long Life, Catalytic Advanced Green Monopropellant Thrusters
- Long Life Cathode Heaters for Hollow Cathodes
- Reliable UHTC Ceramic-Metal Joints for Hypersonic Applications
- Vacuum Compatible High Gradient Insulators
- High Performance Plasma Channel Insulators for High Power Hall Thrusters
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Fault Management Technologies - Metrics Evaluation and V&V
- Model-Based Off-Nominal State Isolation and Detection System for Autonomous Fault Management
- Standardization of Fault Management Techniques and Activities with TEAMS
- Fault Management Simulation and Visualization Tool
- Fault Management Technologies
Research funding history
61 SBIR/STTR records share this UEI (1993–2017). Reported award amounts total $13,380,891. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Energy, National Science Foundation