Ultra-High Thermal Conductivity, Thermal Expansion Matched, Low Density Materials for Dimensionally Stable Space Structures

High stiffness structural composite skins with high thermal conductivity thermal cores (>800 W/mK) for mounting satellite sensors and electronics were demonstrated. Further hybridization with 800 W/mK “z” inserts with local thermal expansion matching provides for thermal management. This was accomplished while reducing mass and exceeding the stiffness of Al isogrid structures. Phase II is directed toward rapid response to space where satellites will be required to be tailored, configured and launched within a period of one week. This technology will be scaled to ~0.5m x 0.5 m panels with tailored locations of “z” inserts which will be delivered to the customer/assembler within three to four days. Blank pre-manufactured panels and pre-machined/electroplated “z” inserts will be held in inventory. When the customer provides the electronics/sensor mounting map, panels will be machined, plated and the “z”insert/local CTE pads will be soldered to specification, QC inspected and shipped to the assembler. A thermal and mechanical properties database will be generated. Thermal models and micromechanics models of thermal stresses associated with “z” inserts will be generated to provide predictability and extension of the technology. Full scale panels of specified design will be delivered to the Air Force for evaluation. BENEFIT: Passive methods for thermal management and thermal leveling will result from the research. Rapid response ability to tailor and deliver panels within a few days is provided. Low cost CTE matched materials with ultra-high thermal conductivity will become available for the aerospace and defense electronics thermal management industry. In the commercial sector, this technology will also enable the replacement of high density/heavy, high cost Mo/Cu heat sinks used for hybrid electric automobiles as well as other commercial applications.