Ultra-High Thermal Conductivity, Thermal Expansion Matched, Low Density Materials for Dimensionally Stable Space Structures

Ultra high thermal conductivity low-cost materials with thermal expansion matched to electronic devices, actuators and thermal electric cooling systems are proposed. These passive materials enable other technologies but provide for the thermal leveling required for advanced optics and sensing systems. Aluminum alloys reinforced with natural graphite platelets have demonstrated engineered thermal expansion over the range of 9 ppm/K to 4 ppm/k while exhibiting thermal conductivity values of 600 to 800 W/mK respectively. Thus, the CTE can be precisely matched to any known TEC device or semiconductor/laser diode array, LED array. Further, using local hot spot remediation, the CTE at mounting pads can be exactly matched to the device where multiple device types are proposed or required. This permits maximum heat spreading while providing for local CTE matched heat sinking. Other features of the AlGrp materials includes the flexibility during processing which permits the thermal plane to be contorted into complex geometries, around corners, and to be incorporated into hybridized structural shapes. The proposed research will characterize the component materials, demonstrate hot spot remediation and provide thermal/mechanical models that will enable the design of Phase II demonstration components. A subcomponent will be developed, thermally modeled and mapped. BENEFIT: Passive methods for thermal management and thermal leveling will result from the research. These passive methods will enable and enhance the effectiveness of active methods such as TEC and vapor chambers. Low cost CTE matched materials with ultra-high thermal conductivity will become available for the aerospace and defense electronics thermal management industry. This technology will also enable the replacement of high density/heavy, high cost Mo/Cu heat sinks used for hybrid electric automobiles as well as other commercial applications.