SBIR/STTR Research Award
Flip Chip Bonding Technology Development for Multi-Chip Modules with Superconducting Integrated Circuits
Award amount
$747,159Program and phase
STTR · Phase IIAward year
2009Award details
- Awarding agency
- Department of Defense
- Branch
- Navy
- Recipient company
- HYPRES INC
- Proposal award date
- 2009-04-22
- Contract end date
- 2012-05-24
- UEI
- Z3BBX7KX4WU5
- Solicitation number
- 2007.
- Topic code
- N07-T018
Research abstract
HYPRES in collaboration with Stony Brook University proposes to develop flip-chip bonding technology for assembling up to 4-chip MCMs operating at cryogenic temperatures. This will address the critical area of the MCM technology development and transition to full commercialization of the superconductor MCM technology for DoD and commercial satellite and wireless communications markets. The ultimate goal of this Phase II STTR is to develop a manufacturable process of bonding and assembling multiple superconducting and mixed-technology (hybrid) chips into multi-chip modules with data transfer rates between the chips in excess of 100 Gb/s.
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Superconductor TDC for SNSPD Array Readout with 2.5 ps Time of Arrival Resolution
- Josephson Parametric Amplifier for Sensitive Broadband RF Receiver
- Radio Frequency Digital-to-Analog Converter for Multi-band Communication
- Digital Interface between Multigigahertz Transceivers and Room Temperature Electronics"
- Lightweight Terrestrial Remote-Recording Integrated Product (LTR-RIP)
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Wafer Bumping for Ultra-High Data Transfer Rates in Multi-Chip Modules with Superconducting Integrated Circuits
- Flip chip bonding of ICs for 100GHz operation
Research funding history
255 SBIR/STTR records share this UEI (1985–2025). Reported award amounts total $91,527,586. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration, National Science Foundation, Department of Health and Human Services, Department of Commerce