Flip chip bonding of ICs for 100GHz operation

Using manufacturing techniques recently demonstrated at Aguila Technologies, we will develop an inexpensive technology and system for rapidly producing moderate-scale production quantities of re-workable flip chip assemblies with target operating rates up to 100 GHz. The approach involves using 20-40 micron diameter precisely-structured bumps for bonding flip chips to multichip module substrates. The technique uses fabrication and assembly tools which largely already exist at typical wafer fabrication houses. The proposed small diameter, high density (as small as 50 micron pitch), re-workable connections will be designed and optimized to provide efficient connections for microwave and millimeter wave transmission, minimizing losses. Our system will permit creation of flip chip assemblies that employ conventional materials and processes, yet can be applied at either the single chip or wafer level, which is ideal for prototyping small quantities of assemblies during the early stage development of high frequency devices. The proposed technique also allows testing of die before final assembly, as well as allows rework of the modules after testing. Aguila will team with the UCSB's High Frequency Electronics Group to jointly develop and demonstrate the high-frequency flip chip technology.