SBIR/STTR Research Award

Isothermal Satellite Panels and Inter-Panel Connections

Award identifier a01f64dfac9572575197bc78f7b4b6313f421f9f4845600dfae8511e254bdfc3Awarding agency Department of Defense · Air Force

Award amount

$99,954

Program and phase

SBIR · Phase I

Award year

2009

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Award details

Awarding agency
Department of Defense
Branch
Air Force
Recipient company
THERMAL MANAGEMENT TECHNOLOGIES, L.L.C.
Proposal award date
2009-03-26
Contract end date
2010-03-23
UEI
ZK7GFXFGCER3
Solicitation number
2008.3
Topic code
AF083-217

Research abstract

Thermal Management Technologies (TMT), a newly formed small business with strategic ties to the Space Dynamics Laboratory (SDL) at Utah State University, is proposing to determine the feasibility of fabricating isothermal panels and inter-panel connections that will meet the thermal performance requirements as outlined in AF083-217.  These panels are based on Channel Panel technology that has been under development at SDL for the past decade. Recent advancements in manufacturing processes allow the fabrication of Channel Panel units using a variety of materials including metals, plastics and carbon-based composites. These panels may be fabricated into strong, light-weight sandwich-like panels that serve as the mechanical structure as well as the thermal management system. Electrical and electronic components may be molded into or attached directly to the panels making them truly multifunctional modules.  TMT has already demonstrated functioning isothermal Channel Panels in a 1-g laboratory environment. The Phase I objectives are: (1) develop modular satellite architecture that is compatible with Channel Panel technology; (2) design inter-panel connections that minimize temperature gradients between panels; (3) analyze mass and thermal capacitance parameters for the modular multifunctional panels and connections; (4) investigate space environment compatibility of Channel Panel and inter-panel connections. BENEFIT: Development of modular structural panels that accept component heat, convey that heat to energy rejection surfaces, and remain essentially isothermal will provide the Air Force with low-cost, low-risk, plug and play thermal management solution. If the connections between modular panels can be shown to exhibit low thermal impedance and change-out of modular panels can be quickly and efficiently accomplished, the rapid response objectives can be realized. Any aerospace firm competing for contracts to build rapid response spacecraft will also have serious interest in demonstrable and feasible technologies capable of meeting deployment time constraints. These companies will provide a very substantial commercial market for the use of this technology.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

4 SBIR/STTR records share this UEI (2009–2013). Reported award amounts total $1,060,507. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense

Agency intelligence

Department of Defense

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