High Planer and Through-Thickness Conductivity Enhancement for Lightweight Isothermal Composite Satellite Panels

KaZaK Composites, supported by a diverse team of in-house and subcontractor experts in materials, processing, thermal design and satellite structures, will develop and demonstrate a cost-effective, lightweight isothermal satellite panel that integrates a range of interrelated technologies to ensure a uniform temperature field both across and through the thickness of satellite bus structure. The proposed solution involves creation of an advanced 3D fabric with highly conductive pitch-based carbon fibers. 3D fabric will provide Z-direction continuity via mini thermal paths created by through-thickness fibers. Inter-panel connections will be reduced by folding one continuous sheet of fabric to form the main satellite bus. Thermal contact resistance of the smaller number of remaining inter-panel connections will be minimized using advanced fillers and fastening techniques. All surfaces will be polished and coated to expose fibers on panel faces and edges.  In Phase I, KaZaK will focus on analytical design of flat plate thermal panels, prototype fabrication and thermal testing. Data will demonstrate thermal performance of both panels and inter-panel connections. Results will provide the Air Force with sufficient confidence in the concept to move forward into Phase II, where full scale demonstration using our proposal partners spacecraft bus structure will occur. BENEFIT: A novel design and manufacturing process for creation of isothermal satellite panels will enhance the ability of future high performance systems to access technology that provides high thermal conductivity in all directions, including in-plane, through-thickness and across inter-panel joints. KaZaKs solution could be employed by commercial satellite makers such as MicroSAT Systems, who has expressed direct interest in and support of KaZaKs solution. Larger spacecraft and aircraft manufacturers such as Lockheed Martin, Raytheon, Northrop Grumman, and Boeing, as well as the computer/electronic chip packaging industry, could exploit the lightweight, high thermal conductivity and good structural properties of KaZaKs proposed solution in a variety of applications where these features are important. Possible alternative applications include circuit boards, heat spreaders, heating and cooling systems, and missile bodies.