Disruptive techniques for hybridization of focal plane arrays for optical imaging sensors

Optical imaging sensors are a critical technology for the warfighter. These sensors operate across the entire wavelength spectrum. They have been deployed across all military platforms especially ground vehicles, aircraft, and satellites. A key issue in increasing image resolution and lowering cost is the assembly of the focal plane array. The hybridization of the detector array and read out integrated circuit is a limitation in the manufacturability of these sensors. This proposal will demonstrate the use of new alignment techniques to develop a disruptive method for hybridization. This method will leverage recently developed approaches for making alignment features in semiconductors. In addition, it will also develop new interconnection processes that eliminate the need for indium based materials. This new process offers significant advantages for both cost and yields. It will also provide a path to obtain increased pixel counts at reduced pixel pitch. This will result in the availability of increased resolution sensors at lower costs. This will allow further deployment of imaging sensors for individual soldiers and unmanned vehicles. BENEFIT: This program will result in the development of a disruptive technology for fabricating image sensors based on focal plane arrays. The technology can be quickly commercialized and applied to imaging sensors.