Universal, Modular Electronics Cooler

Proposed is the development of a Universal Modular Electronics Cooler for the Army that is applicable to cooling of high density electronics components used in Signals Intelligence and Electronics Warfare. The proposed cooler will include a variable capacity vapor compression system with variable or fixed air flow as per load requirements. The performance of the high efficiency cycle will be enhanced by the use of advanced variable speed drive and pulsating thermal expansion valve technologies. The control system will allow load tracking without the use of remote sensors and will have a self explanatory user interface. The cooler will operate at all relevant military supplied DC and AC voltages. The result will be a product that has more robust performance, dramatically smaller volume and lighter weight than competing technologies while attaining wide-ranging applicability.