Modular Transit Case Cooler

Aspen Systems proposes to develop a modular cooling system for mobile electronics applications. This system will be highly adaptable and have the capability to maintain lower than ambient temperatures in mobile and stationary electronics enclosures that are deployed to hot desert environments. While maintaining these low operating temperatures, the electronics systems will be completely sealed against dirt rain and dust so that MIL STD-810F environmental requirements can be met. Features include a high degree of modularity, enabling the rapid fabrication and fielding of cooling systems that are tailored to system requirements without non recurring engineering costs. The major benefit to the warfighter is the ability to utilize very high performance Commercial Off The Shelf (COTS) electronics with out jeopardizing system life due to thermal overload of sensitive electronics. The system will be designed for minimum power consumption, minimum weight, maximum efficiency, and high modularity. With small size and high cooling power, multiple units can be used in the same enclosure to match the cooling requirements against the thermal load in the system. It is anticipated that the system will be fully tested at the conclusion of Phase I, and ready for production at the conclusion of Phase II.