VOXL 3 - Maximizing Image Processing per Gram

ModalAI has a proven track record with products like VOXL 2, widely deployed in UAS systems. Building on this legacy and over $18.7 million in government contracts, VOXL 3 represents the next leap in thermal AI processing for small UAS (sUAS), designed to meet the stringent size, weight, and power (SWAP) requirements of modern military and commercial applications. Modern battlefield and commercial operations require compact, high-performance platforms capable of real-time thermal imaging and autonomous navigation, especially in GPS-denied environments. Current systems struggle with the physical constraints imposed by advanced sensor payloads, particularly for soldier-borne applications. VOXL 3 addresses these challenges by reducing the footprint and enhancing processing power, thermal image fidelity, and sensor integration. During Phase I, ModalAI evaluated two Qualcomm SoCs—the QCS6490 and QCS8550—across three form factors: Micro (38x38 mm), Mini (42x42 mm), and Classic (36x70 mm). Both chipsets proved viable for the Mini and Classic formats; however, only the QCS6490 met the stringent requirements of the ultra-compact Micro variant.  Phase II focuses on transitioning VOXL 3 from concept to a fully functional prototype. Key objectives include:Requirements Solidification: Working closely with Army and DoD stakeholders to define performance metrics, environmental constraints, and operational needs.Design and Architecture: Developing modular hardware and software systems that maintain compatibility with the VOXL ecosystem. The design emphasizes modularity per DoD’s Modular Open Systems Approach (MOSA), ensuring flexibility and future upgrades.PCB Layout and Testing: Creating robust PCB layouts optimized for signal integrity and thermal management, followed by comprehensive design verification and flight testing under dynamic conditions.Software Integration: Porting and optimizing the VOXL SDK on an updated Linux kernel—four years more current than previous versions—to enhance security, performance, and scalability.Advanced Processing Capabilities: Implementing 18-bit ISP pipelines and integrating deep neural network acceleration (up to 45 TOPS) for real-time thermal image processing and situational awareness. Advanced Visual Inertial Odometry (VIO) supports precise navigation in GPS-denied environments.VOXL 3’s compact design and enhanced performance are expected to significantly improve mission effectiveness for U.S. Army modernization programs and expand into commercial markets such as industrial inspections and indoor asset management. With a pre-release validation targeting existing VOXL 2 customers, ModalAI plans to launch 3,000 units in Year 1, scaling to over 20,000 units by Year 5. This upgrade not only reduces weight and cost but also provides critical enhancements in low-light and thermal imaging, offering individual soldiers capabilities previously available only at the squad level.