Nano-material Conducting Wires With Enhanced Electric/Thermal Conductivity and Mechanical Strength

Small-size high power electronics is in the roadmap of the electronics from both military and civil application demands, especially for the military vehicles, where the complex vertronics are used in high vibration and harsh conditions. Hence the electrical cables, wires, circuit leads, contacts, and interconnects are being improved in three areas: (1) electrical conductivity for less heat generating and high power efficiency, (2) thermal conductivity for effective heat dissipation, and (3) mechanical strength resistant to harsh environment. Based on the results of the recent studies performed on the forming mechanism of the high strength and high conductivity (HSHC) nano material copper, Aegis Technology Inc. intends to develop a cost-effective processing technique derived from the ball-milling process under low temperature conditions in order to produce high volume HSHC Cu. Then from the produced bulk Cu, various dimensions from tenths of a micrometer to several millimeters of wires will be produced with enhanced mechanical strength (>5times) and high electrical conductivity (>80%) as compared to the pure coarse grain Cu.