Packaging and signal transfer hardware for cryogenically cooled RF receivers

While cryogenics is an enabling component for many new technologies, the integration of components into cryocoolers is fraught with challenges that hinder system deployment and technology advancement. We propose an cryogenic packaging approach based on experience and novel concepts to provide vibration isolation, thermal stability, interfaces for signal transfer hardware (either RF or optical, or both), and connectivity to a variety of commercial 4K cryocoolers. The devices can be integrated into 19” rack mounts for both the 4K cryocooler and compressor, with reliable, convenient and efficient connections to temperature stages. During Phase I we plan to design and demonstrate the predicted performance. In Phase II we plan to build and test a prototype version of the systems.