Packaging and signal transfer hardware for cryogenically cooled RF receivers

The electronic benefits of using cryogenically cooled and/or superconducting electronics comes from higher potential speeds, higher signal to noise and lower thermal noise. Use of cryogenically cooled and/or superconducting electronics for shipboard, airborne, and long life stationary applications prohibits the use of liquid cryogens. There is no standardized cryogenics platform available for use at this time that employs closed-cycle (cryogen free) refrigeration. In Phase I, we propose to design and (in Phase II) construct a Rack Mounted Cryogenic Platform that will satisfy the need for packaging of signal transfer hardware for cryogenically cooled RF receivers and other superconducting electronics. We will establish thermal criteria that will allow “hot swapping” of key elements of an instrumentation package having superconducting and/or cryogenically cooled circuit elements. This will lead to the design of a complete system that will have access to the cryogenically cooled circuit elements by way of an air lock system and standardized chip carriers. The chip carriers will demonstrate thermal grounding and electrically connected functions compatible with hot swapping capability. This includes cryocooler, cryostat, airlock/actuator, chip manipulator, superconducting-to-normal low loss leads, and vacuum electrical feedthroughs.