Atomic layer deposition of atomic oxygen and UV resistant coatings for spacecraft

Physical Sciences Inc. (PSI) and Harvard University propose to develop atomic oxygen and UV/VUV-resistant conductive coatings for spacecraft in Low Earth Orbit (LEO). We will use Atomic Layer Deposition (ALD) to deposit thin conformal pinhole-free films of conductive oxides on Kapton coupons. We will evaluate the performance of the coatings with PSI's FAST^TM atomic oxygen source. We will demonstrate that the films have mass loss of < 10^-26 g/atom under exposure to 5 eV atomic oxygen and 10^-4 UV/VUV photons per incident oxygen atom and have sheet resistance < 10^10 ohm/square both before and after exposure to simulated space conditions. We will take advantage of the atomic-level control of the ALD process to tune the properties of the coatings and meet the requirements of survival in LEO. During the Phase I program we will iterate deposition and film evaluation in order to down-select from our initial materials choices and determine the optimum coating formulation. During Phase II, we will demonstrate the coating on a complex-shaped spacecraft component and will address further requirements such as mechanical properties. In Phase III, we will scale up production in partnership with a supplier of thin film materials to the aerospace industry.