Low-Profile Tamper Detection Sensors

What is proposed is an inexpensive nearly undetectable method for detection of any unauthorized effort to access security sensitive electronics. This new approach would defeat the entire gamut of intrusion events from board probing through to device-level intrusive dissection making it extraordinarily difficult to reverse engineer the electronics. The use of a new class of semiconductor materials can be applied at individual IC level through to an entire circuit board assembly as to be extremely intrusion sensitive. External device integration can extend from very low profile integration to thick layer heat sink augmentation or replacement. Internal device integration is initially focusing on memory circuits and processors (e.g. BGA, LGA, TSOP, LQFP and PGA), to be quickly followed by other electronic hardware. Integration of the semiconductor sensors with boundary scan assist architecture will generate signals that may be sent to destroy all the dies inside the microelectronics while constantly monitoring the health of all the chips on a PCB.