Low-Profile Tamper Detection Sensors

What is proposed is an inexpensive nearly undetectable method for detection of any effort to tamper with security sensitive electronics. This new approach would defeat the entire gamut of intrusion events from board probing through to device-level intrusive dissection making it extraordinarily difficult to reverse engineer the electronics. The use of a new class of semiconductor materials can be applied at individual IC level through to an entire circuit board assembly as to be extremely intrusion sensitive. External device integration can extend from very low profile integration to thick layer heat sink augmentation or replacement. Internal device integration options include Small Outline (SO), Ball Grid Array (BGA), and Land Grid Array (LGA). Integration of this new class of semiconductor materials also enables a completely new approach to autonomous electronics autodestruct in response to any unauthorized access attempt.