SBIR/STTR Research Award
Thin Copper-Graphite Composite Cold Plate for Thermal Management of High Density Electronics
Award amount
$100,000Program and phase
SBIR · Phase IAward year
2007Award details
- Awarding agency
- Department of Defense
- Branch
- Missile Defense Agency
- Recipient company
- METAL MATRIX CAST COMPOSITES, LLC (DBA M
- Proposal award date
- 2007-02-28
- Contract end date
- 2007-08-28
- UEI
- Not reported
- Solicitation number
- 2006.3
- Topic code
- MDA06-030
Research abstract
Copper-graphite composite is proposed for a thin liquid-cooled cold plate for high density electronic thermal management. The proposed cold plate will have CTE in the range of 2~9x10-6 /°C to match those of semiconductors such as SiC, silicon, GaAs, as well as ceramic substrates. The composites have a thermal conductivity of ~200 W/m K in the through-plane direction and ~300 W/m K in planar directions. The proposed cold plate will be able to withstand temperatures up to those of copper-silver brazing (780 degree C) for subsequent die attachment or substrate bonding, without re-melting the brazing joint.
Technology keywords
Not reported
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Thin Copper-Graphite Composite Cold Plate and High Performance Al/Gr Composites for Thermal Management of High Density Electronics
- Thin Copper-Graphite Composite Cold Plate and High Performance Al/Gr Composites for Thermal Management of High Density Electronics
- NOVEL PACKAGING AND INTERCONNECT TECHNOLOGIES FOR GREATLY ENHANCED FOOTPRINT, THERMAL, AND RADIATION PERFORMANCE IN MDA APPLICATIONS