NOVEL PACKAGING AND INTERCONNECT TECHNOLOGIES FOR GREATLY ENHANCED FOOTPRINT, THERMAL, AND RADIATION PERFORMANCE IN MDA APPLICATIONS

The goal of this Phase-I SBIR effort is to establish the feasibility, performance, and advantages of a combination of novel technologies that provide a practical high reliability and high performance solution to challenges encountered in increasing the capabilities of interceptor processors as well as dense multi-board electronic applications. The technology developed in this program will provide breakthrough increases in interconnect density accompanied by enhanced thermal management, high data throughput, relaxed manufacturing tolerances, low power, low crosstalk, and greatly reduced EMI and radiation sensitivity. In addition, the reliability in high shock, vibration, and repeated thermal excursions will be improved. A key feature of this technology is that it has no major cost drivers and is expected to result in a very low-cost and robust interconnection technology. The Phase-I effort includes design and modeling of the technology, the construction of feasibility demonstrators, their experimental evaluation, initial optimization of the technology, and the design of a high performance Phase-II prototype demonstrator that will be built and evaluated by Primes in a potential follow-on Phase-II effort.