Ballistic Missile Defense Anti-Tamper Volume Protection

The purpose of this Program is to demonstrate an inexpensive thin Multi-threat Detect sensor compatible with die integration, that can provide reliable detect information on multiple kinds of attempts to access information (design or code) contained within security sensitive microelectronics. Although the multi-threat detection sensors are passive (power independent), they can rapidly detect a range of threats including: physically tamper; X-ray; magnetic; electromagnetic and acoustic reverse engineering methods. Direct die integration/packaging will be investigated for PPGA type and BGA type packages. The primary goal is to clearly demonstrate that these Multi-threat Detect sensors can accurately detect a variety of potentially adversarial threats with a high degree of sensitivity.