A Low-Cost and Scalable Dielectric Films
Award amount
$100,000Program and phase
SBIR · Phase IAward year
2007Award details
- Awarding agency
- Department of Defense
- Branch
- Air Force
- Recipient company
- APPLIED THIN FILMS, INC
- Proposal award date
- 2007-02-23
- Contract end date
- 2008-02-23
- UEI
- S5SDX2NKH4J9
- Solicitation number
- 2006.3
- Topic code
- OSD06-EP3
Research abstract
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- Large 3D CMC RF Windows for Extreme Hypersonic Environments
- Ultra-Thin Ceramic Film Based Passive Electronics
- Antennas and Antenna Radomes with Extreme Thermal Shock Resistance for Missile Applications
- Antennas and Antenna Radomes with Extreme Thermal Shock Resistance for Missile Applications
- High temperature moisture sealants for hot exhaust structures on advanced system
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Nanocomposite thin films for capacitors
- Novel Processing of Dielectric Films
- Deformable Metal RubberTM Capacitors with High Energy-Density Nanostructured Cores
- Nanocomposite polymer dielectric film with very high dielectric strength
- High-Temperature, Flexible Inorganic Dielectric Films for High Energy Density Capacitors
Research funding history
52 SBIR/STTR records share this UEI (1998–2024). Reported award amounts total $19,123,179. Reported amounts are not federal obligations.
Phases: Phase I, Phase II, Phase II – Direct to Phase II
Agencies: Department of Defense, Department of Energy, National Science Foundation, National Aeronautics and Space Administration