Innovative Shape Memory Materials Process Techniques for Microelectronic Device Packaging

Shape memory materials have shown great potential in MEMS applications, including improved housing structural performance and packaging reliability. In this Phase I study, new shape memory material processing and manufacturing technology will be developed, i.e. (1) Severe deformation of CNT-SMP composites for improved CNT dispersion, to be considered for MEMS housing structure materials with high strength, self-recovery, and electromagnetic shielding functions; (2) Combined reaction synthesis and forming for low-temperature/low energy processing of SMA and composites at low cost and improved performance, to be considered for MEMS structures and actuator components. The project will also develop understanding of the deformation process of SMM at the molecular, microstructural and macro scales, and will integrate the knowledge in mechanics, physics, chemistry and thermodynamics to build a solid scientific and experimental foundation towards innovative new MEMS material processing techniques. The proposed approach and objectives, if successful, will resolve critical issues of MEMS packaging performance and reliability and will provide low-cost and high efficiency SMM manufacturing methods.