SBIR/STTR Research Award

Innovative Technologies Supporting Affordable Increases in Power, Efficiency, and Bandwidth for Ballistic Missile Defense System (BMDS) X-Band Radars

Award identifier 36c6db2f6a67b6db12fa7167b8f607822bea292e6c1ef1e3c28f33206da86481Awarding agency Department of Defense · Missile Defense Agency

Award amount

$100,000

Program and phase

STTR · Phase I

Award year

2006

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Award details

Awarding agency
Department of Defense
Branch
Missile Defense Agency
Recipient company
Group4 Labs, LLC
Proposal award date
2006-08-24
Contract end date
2007-02-24
UEI
GTEPACJDJR64
Solicitation number
Not reported
Topic code
MDA06-T012

Research abstract

This Phase-I STTR MDA Proposal proposes the use of a new class of diamond-seeded solid-state material system for the manufacture of virtually all heat-generating solid-state electronics in X-band and Ballistic Missile Defense radar components and systems. In this proposal wherein much preliminary (DARPA- and MDA-funded) work has been demonstrated hitherto by the authors, all or most of the basic semiconductor devices in an electronic RF unit (e.g. GaN HEMTs, Power Amplifiers, etc.) are replaced with Semiconductor-on-Diamond based devices to enable nearly total and immediate heat extraction from the device’s active region. A 4” Gallium Nitride-on-Diamond will be demonstrated for the first time here. Polycrystalline free standing CVD diamond – nature’s most efficient thermal conductor – enables nearly perfect heat extraction from a “hot” device, owing to the extreme thermal conductivity of diamond (GaAs, Si, and SiC are 35W/m/K, 150W/m/K and 390W/m/K respectively; diamond ranges from 1200-2000 W/m/K depending on quality). In the proposed scheme, the device’s active epitaxial layers are removed from their original host substrate and transferred to a specially treated low-cost CVD diamond substrate using a proprietary low-cost manufacturable scheme. The semiconductor-on-diamond technology proposed here may be applied to Si, GaAs, GaN, SiC, SiGe, etc. at up to 8” in wafer diameter.

Technology keywords

Not reported

Other awards by this recipient

Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.

Awards with the same topic code

Verified by an exact topic code match. This is not a text-similarity match.

Research funding history

13 SBIR/STTR records share this UEI (2005–2010). Reported award amounts total $7,274,964. Reported amounts are not federal obligations.

Phases: Phase I, Phase II

Agencies: Department of Defense, National Aeronautics and Space Administration, Department of Health and Human Services

Agency intelligence

Department of Defense

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