Micro-channel/Low Profile Heat Spreader

Thermal management is a limiting factor in a variety of areas in the Ballistic Missile Defense System (BMDS). Proper thermal management of current Si and GaAs devices as well as wide band gap semiconductors is crucial for meeting survival and reliability requirements in advanced Radar, Communications, Electronic Warfare (jammers and electronic countermeasures), Space Electronics, and High temperature Power Conditioning and Control systems. In this program an innovative heat spreader is being developed which offers a thermal performance of 2-5x greater than existing spreaders while also providing a thermal expansion match to chip materials, high strength and stiffness, and good solderability. In addition these heat spreaders will only be moderately more expensive than existing spreaders and act as direct drop-in replacements for current Cu/Mo spreaders for easy insertion of the technology. The first target application for these spreaders will be in phased array radar T/R modules. During this program Omega will work closely with a major defense contractor to develop these heat spreaders for a radar system. These new heat spreaders will allow higher power levels to be achieved in current electronic systems as well as to help enable new systems based on wide band gap semiconductors.