Low Profile Multi-Mode Tamper Detection Sensors

The objective of this proposed effort is to research, develop and demonstrate a prototype of a multi-mode low profile sensor that will detect a wide range of reverse engineering attacks. This will be accomplished by creating a multi-layered sensor architecture into which a myriad of AT Sensors can be inserted. This effort uses the multi-layered approach to employ two complementary AT sensor technologies: micro-electro-mechanical-system (MEMS) vibrational sensors and nanoparticle doped thin film sensors. By combining these technologies, the sensor will be able to detect reverse engineering attacks from acoustic microscopy, mechanical grinding, X-rays, and focused ion beams (FIB). The effectiveness of this device will be measured in terms of metrics such as: variety of tamper events detected, shelf life, detectability, difficulty to disable once discovered, design flexibility, voltage and current characteristics under relevant environmental extremes, false alarm properties, cost, manufacturability, and operations and support (including R&M) impacts.