High-Performance Hybrid Electronic Enclosure

The primary objective of the Phase 2 program is deliver one or more “Total Box” hybrid composite avionics liquid flow-though enclosures that is ready for flight-testing. Deliverables will be tailored to a specific system application. Hybrid heat exchanger coldwall innovations with demonstrated manufacturability developed in Phase 1 will integrate to a complete enclosure in Phase 2. Low cost, low weight and high thermal performance are achieved through use of high thermal conductivity graphite fibers, low cost conductive Carbon-Carbon, low cost discontinuous 3D fiber composites, and aluminum for fluid channel paths. The integration of the design and materials will significantly lower module temperature and reduce mass by up to 30% relative to current enclosures. To meet thee Phase 2 objective, tasks will include: (1) Analytic refinement of the coldwall embedded heat exchanger technology for maximum thermal performance, (2) Cost verses performance analysis for two designs developed in Phase 1, (3) Composite material final selection and allowables definition and (4) Demonstration of a robust coating technology for EMI protection, increased surface toughness, and abrasion resistance. VME, PCI and SEM-E module formats will stimulate many marketing opportunities that will be the focus of Phase 3.