High-Performance Hybrid Electronic Enclosure

The objective of this proposal is to establish and demonstrate the feasibility of a low cost, high thermal performance, lightweight liquid cooled ATR chassis utilizing a hybrid of ultra high thermal conductivity graphite fibers, structural composite incorporating low cost discontinuous 3D fibers, and metallic materials where necessary. This innovation partners the conductive heat transfer capability of high modulus pitch-based graphite fibers exceeding 500 W/mK with the capacity to transmit large amounts of heat with small temperature gradients into closed looped liquid coolant system. Key technical focal points will be to establish cost effective hermetic liquid flow through while designing the system solution to minimize or eliminate internal stress at interfaces as a result of coefficient of thermal expansion (CTE) mismatch. The primary technology development will be to design an enhanced low cost material and manufacturing solution and to maximize thermal performance between the card rail/slot liquid cooling paths. Cooling efficiency goals are targeted to exceed current baseline aluminum chassis configurations. Key technologies including materials and processes will be demonstrated in Phase 1. The application of this opportunity will result in implementation of a low cost manufacturing design leading to production of a full-scale qualifiable working chassis in Phase 2.