Conformal Semiconductor Circuits

Crossfield proposes to develop a hybrid direct write technique for developing conformal circuits and semiconductors. Crossfield, together with Honeywell and the Massachusetts Institute of Technology (MIT) intend to demonstrate a conformal circuit technique that enables the metal elements of the circuit (such as power and signal traces or antennas) and supporting semiconductors such as bias circuits to be directly written to the conformal surface. The remaining active devices will employ a high performance semiconductor fabrication technique based on Honeywell's Silicon on Insulator (SOI) technology. SOI is well suited to the conformal circuit fabrication process and will enable digital or millimeterwave devices to be added on the previously developed metal patterns. The finished conformal circuit will be low cost, while enjoying the high performance of existing, mature semiconductor technology.