Chip-to-Chip Optical Interconnects Using Integrated Photonic Crystal Lightwave Circuits

The goal of this Phase II STTR program is to develop photonic crystal (PC) technologies which can enable photonic lightwave circuits (PLC¡¦s) that are monolithically integrable with optoelectronic devices and wafers, thereby providing a new technology platform for the heterogeneous integration of photonic and optoelectronic functions. This can significantly increase the density of lightwave circuits, while minimizing intermediate hybrid optical packaging to result in highly compact and more reliable optical subsystem modules. Using a PC-based lightwave circuit in combination with OCC¡¦s optoelectronic switching devices can lead to the future realization of highly-integrated, high density optical interconnects for applications in mƒ{-satellite space platforms and in unmanned combat air vehicles (UCAV), where compactness, light weight, small size and reliability are all enhanced by multi-functional integration at the chip or wafer-level. Coherent PC-based devices can perform novel optical functions such as self-modulation, optical clock generation and distribution, optical logic and optical storage, which will be investigated under this Phase II STTR program. OCC has had extensive experience in developing advanced high performance optical interconnects for military applications, and has wide-ranging expertise in system architecture, epi-material growth and optoelectronic device technology. OCC¡¦s partner in this effort is Professor Axel Scherer at the Califoria Institute of Technology, who brings expertise in photonic crystal design, fabrication, and characterization to this joint effort.