Chip-to-Chip Optical Interconnects Using Photonic Crystal Emitters and Waveguides

The goal of this proposed Phase I STTR effort is to demonstrate the feasibility of incorporating photonic crystal (PC) technology within OCC's existing optoelectronic module technology. This will be accomplished through the design and modeling of PC light emitters and waveguides, as well as characterization of their coupling behavior with external systems. The utilization of nanoscale PC technology promises superior wavelength selectivity, reduced temperature sensitivity, and increased density of interconnecting waveguides. OptiComp Corporation occupies a 7000 square foot facility, which includes a full service, semiconductor fabrication cleanroom with MBE wafer growth as well as optoelectronic testing and measurement laboratories. OptiComp design facility includes semiconductor modeling and CAD capabilities. In addition, the University of Illinois' Micro and Nanotechnology Laboratories include an 8000 square foot class 100 fabrication and 8000 square foot class 1000 growth facility. The proposed Phase I STTR effort will offer a dual use commercialization opportunity for applications such as photonic crystal (PC) optoelectronic chip-to-chip interconnects. Such devices can provide terabit bandwidths for on-board, radiation-hard, space applications, as well as specialized military platforms and commercial datacom systems.