SBIR/STTR Research Award
High Temperature Structures With Inherent Protection
Award amount
$70,000Program and phase
SBIR · Phase IAward year
2005Award details
- Awarding agency
- National Aeronautics and Space Administration
- Branch
- Not reported
- Recipient company
- ATS-MER, LLC
- Proposal award date
- 2005-01-21
- Contract end date
- 2005-07-25
- UEI
- F8HABDW7DVG8
- Solicitation number
- Not reported
- Topic code
- X6.02
Research abstract
The hot structures for current space vehicles require an atmospheric entry thermal protection system. Reusable hot structures that can function without requiring any atmospheric entry thermal protection system for space vehicle would constitute a paradigm. A high temperature stable fiber reinforcement and a ceramic material that exhibits atmospheric entry thermal stability can be combined into a composite which possess the mechanical properties to serve as a reusable hot structure that can function without any atmospheric entry thermal protection system. This unique and new ceramic matrix composite (CMC) will be developed and characterized to demonstrate it can meet the requirements of a reusable hot structure for space vehicles which can operate without any atmospheric entry thermal protection system and optimized samples will be delivered for more detailed testing at NASA
Technology keywords
Not reported
Other awards by this recipient
Verified by the same UEI. These are other public SBIR/STTR award pages, not a merged company record.
- AM of Layered Structures
- Large Parts Additive Manufacturing
- High Value Carbon Products from Domestic Coal
- Ultra-lightweight Lubrication Free Hybrid Carbon Composite Ring-less Piston Engines for Remotely Piloted Aircraft
- Solid State Non-powder Process for Boron Nitride Nanotube Metal Matrix Composite
Awards with the same topic code
Verified by an exact topic code match. This is not a text-similarity match.
- Radiation Hardened Nanobridge based Non-volatile Memory for Space Applications
- Wide-Temperature Radiation-Hardened Interface Chipsets Utilizing Delay-Insensitive Asynchronous Logic
- Rad-Hard and ULP FPGA with "Full" Functionality
- Embedded 3D Nonvolatile Memory
- Rad-Hard and ULP FPGA with "Full" Functionality
Research funding history
464 SBIR/STTR records share this UEI (1985–2018). Reported award amounts total $100,117,977. Reported amounts are not federal obligations.
Phases: Phase I, Phase II
Agencies: Department of Defense, Department of Energy, National Aeronautics and Space Administration, National Science Foundation, Environmental Protection Agency, Department of Transportation