Multi-Power Source for MEMS Packaging

The objective of this Small Business Innovative Research (SBIR) Program is to develop a methodology to use novel multi-power sources for heater-on-circuit and cooling-on-circuit techniques in MicroElectroMechanical Systems (MEMS) packaging. This concept of multi-power sources, which includes alternative current heating, and the heater-on-circuit are new in MEMS packaging. While most MEMS packaging processes are performed under global heating, a local heating technique is required and often critical to widen the packaging operation temperature window and protect temperature-sensitive circuits. Conversly micro heat pumpng technology is needed to remorve heat or creat a stable ambient. These problems are related and of current importants for a large number of MEMS systems from sensors to microfuel cells. The research of this SBIR Program into multi-power heating/cooling takes advantage of this and will overcome the limitations of each single power source, thus providing an opportunity to develop a general MEMS packaging technology and platform for a wide range of materials, bonding mechanisms and applications.