SBIR/STTR Research Award

Multi-Power Source for MEMS Packaging

Award identifier bb7dae592712f4046e0da0b3709f8240f77cdb0fccc26081676442435c399710Awarding agency Department of Defense · Army

Award amount

$69,700

Program and phase

SBIR · Phase I

Award year

2005

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Award details

Awarding agency
Department of Defense
Branch
Army
Recipient company
NOVELTECH, INC.
Proposal award date
2004-12-15
Contract end date
2005-06-15
UEI
Not reported
Solicitation number
2004.3
Topic code
A04-256

Research abstract

The objective of the Phase I SBIR program is to investigate the feasibility of using multi-power sources fro MEMS packaging, to over comeheating at the bonding the limitations of each single power source to allow localized heating at the bonding area without overheating temperature sensitive electronic circuitry and MEMS devices. Success from this program can lead to developing an advanced MEMS packaging technology and platform for a wide range of materials, bonding mechanisms and applications.

Technology keywords

Not reported

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Agency intelligence

Department of Defense

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